Manipulating the adhesion of electroless plated Cu film on liquid polymer crystal substrate for advanced microelectronic manufacturing

Manipulating the adhesion of electroless plated Cu film on liquid polymer crystal substrate for advanced microelectronic manufacturing

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Summary: abc material The evolution from subtractive to modified semi-additive (mSAP) and semi-additive (SAP) processes has heightened the importance of electroless plated (ELP) copper (Cu) peel strength in the printed circuit board industry.This study introduces a wet process for depositing Cu on liquid crystal polymer (LCP) using advanced electroless plating, incorporating a polyethylenimine (PEI) surfactant, a homemade nano-sized palladium (Pd) activator, and a micro-sculpturing treatment.By adjusting PEI immersion time and substrate roughness in the sub-micrometer domain, the peel strength of the ELP Cu film ranges from under 10 gf/cm to over 600 gf/cm.This wide range meets both low peel strength needs of mSAP peelable Cu foil and the high strength required in SAP.Characterization techniques, including atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), water contact angle (WCA) measurements, and fracture analysis, reveal that ELP Cu peel strength is driven by a here synergistic effect between molecular interaction and physical anchoring.